EM7430 Sierra Wireless

EM7430 Sierra Wireless Embedded Module IC OVERVIEW

The EM7430 is a high-speed connectivity embedded wireless module from Sierra Wireless. It is ideal for industrial M2M and mobile computing solutions, delivering high-speed connectivity with a wide selection of advanced air interfaces, including LTE Advanced with carrier aggregation. The module supports the latest 4G and 3G networks in Asia and the Pacific’s, and will allow a maximum downlink speed of 300 Mbps and a maximum uplink speed of 50 Mbps. The device has a FCBGA-1295 package and is designed for surface mount mounting. It has a maximum operating temperature of 95.1°C and a length and width of 35.5 mm.

Specification:

• Type: High-speed connectivity embedded wireless module
• Supported networks: Latest 4G and 3G networks in Asia and the Pacific’s
• Maximum downlink speed: 300 Mbps
• Maximum uplink speed: 50 Mbps
• Package type: FCBGA-1295
• Mounting style: Surface mount
• Operating temperature range: -40°C to 95.1°C
• Dimensions: 35.5 mm x 35.5 mm

For more information, please visit Sierra Wireless.

FengYun Electronics have got 2406 pieces of the EM7430 in stock. We are also having a versatile collection of electronic components, offered at the lowest prices.

If you’re looking for new genuine electronic components in the market, Please Give us a Call Today, or Request a Quote.